1. 2. 3. material content data sheet sales product name bsf134n10nj3 g issued 4. september 2015 ma# ma001355570 package mg-wdson-2-2 weight* 50.72 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 2.788 5.50 5.50 54969 54969 leadframe non noble metal copper 7440-50-8 44.951 88.62 88.62 886254 886254 leadfinish non noble metal nickel 7440-02-0 0.143 0.28 2812 noble metal silver 7440-22-4 0.567 1.12 1.40 11185 13997 plating non noble metal nickel 7440-02-0 0.111 0.22 0.22 2179 2179 glue plastics epoxy resin - 0.141 0.28 2783 noble metal silver 7440-22-4 0.867 1.71 1.99 17094 19877 solder non noble metal copper 7440-50-8 0.005 0.01 103 noble metal silver 7440-22-4 0.031 0.06 617 non noble metal tin 7440-31-5 1.006 1.98 2.05 19837 20557 passivation plastics epoxy resin - 0.110 0.22 0.22 2167 2167 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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